The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 14, 1989
Filed:
Apr. 30, 1987
Keunmyung Lee, Redwood City, CA (US);
Yoshio Nishi, Palo Alto, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
A via connection and method for making the same for integrated circuits having multiple layers of electrically conductive interconnect lines separated by an insulative layer. The via connection is characterized by a very thin layer of high resistivity material lining the via hole in conductive contact with interconnect lines in two layers. The resistivity of the thin layer material is in a range from about 10 to about 50 times the interconnect line resistivities and generally has a thickness of less than 100 nanometers. The thin layer assures more uniform current flow in the via connection thereby preventing electromigration, with reduced peak local current density by causing current to swing more widely around the corner at the interface between the interconnect lines at the via.