Finish laminates for high frequency circuits

Abstract

A finish laminate for high-frequency circuits, which consists of a metal-covered multilayer structure composed of (I) at least one fundamental laminate in which a glass cloth layer (C) is laminated on at least one side of an ultrahigh molecular-weight polyethylene layer (A) with an adhesive layer (B) interposed between the layers (C) and (A), one fundamental laminate being able to be laminated on another with an adhesive layer (B) interposed therebetween, and (II) a metal foil laminated on at least one outermost layer of the multilayer structure with an adhesive layer interposed therebetween. In one embodiment, the glass cloth layer may be impregnated with a curable thermosetting resin or with this resin and a thermoplastic resin to form a resin-containing glass cloth layer (C.sub.1) or (C.sub.2), thereby dispensing with an adhesive layer (B) when laminating a metal foil on the outermost layer of the multilayer structure.