The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 1989
Filed:
Feb. 17, 1988
David K Hsu, Ames, IA (US);
Donald O Thompson, Ames, IA (US);
Iowa State University Research Foundation, Inc., Ames, IA (US);
Abstract
The method for fabricating a metal body having a flaw of predetermined size and shape located therein comprises placing half of the metal powder required to make the metal body in the die of a press and pressing it to create a flat upper surface thereon. A piece of copper foil is cut to the size and shape of the desired interior crack and placed on the upper surface of the powder and centered in position. The remaining powder is then placed in the die to cover the copper foil. The powder is first cold pressed and removed from the press. The powder metal piece is then sintered in a furnace at a temperature above the melting point of the copper and below the melting point of the metal. It is then removed from the furnace, cooled to room temperature, and placed back in the die and pressed further. This procedure results in an interior flaw or crack. Modified forms of the method involve using a press-sinter-press-sinter cycle with the first sinter being below the melting point of the copper and the second sinter being above the melting point of the copper and below the melting point of the metal.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile