The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 1989
Filed:
Mar. 18, 1988
Applicant:
Inventors:
Kenichi Otsuka, Chiba, JP;
Minoru Nitta, Chiba, JP;
Assignee:
Kawasaki Steel Corporation, Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F / ;
U.S. Cl.
CPC ...
75 / ;
Abstract
In a process for preparing a spherical copper fine powder having an average grain size ranging from 0.1 .mu.m to a few .mu.m, by use of chemical vapor deposition of cuprous chloride vapor with a reducing gas, the vapor deposition zone is maintained at a temperature ranging 900.degree. C. to less than 1,150.degree. C. and the generated particles are quenched subsequently. The generated powder is utilized as a conductive powder which is the main component of a conductive paste.
Otsuka, Kenichi. (1989). Process for preparing spherical copper fine powder (U.S. Patent No. 4810285). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4810285
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile