The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 1989

Filed:

Dec. 10, 1987
Applicant:
Inventors:

James S Aden, Corvallis, OR (US);

Jeffrey A Kahn, Corvallis, OR (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01C / ; H05K / ;
U.S. Cl.
CPC ...
29611 ; 29620 ; 29829 ; 296101 ; 3461 / ;
Abstract

A process for manufacturing a thin film resistor substrate useful, for example, in fabricating an ink jet printhead, wherein discontinuous strips of conductive material are initially patterned on the surface of a resistive layer. These strips are formed using a first series of masking and etching steps of define an 'X' dimension of a resistive heater element. Then, the conductive strips and resistive material therebetween are completely masked in preparation for a subsequent, second etching step used to remove the exposed portions of the resistive layer and thereby define a 'Y' dimension of the resistive heater element. These steps leave smooth contours, good step coverage and high quality bevelled edges of the thus defined conductive and resistive layers. These layers are now ready for subsequent passivation layer, barrier layer and orifice plate deposition processes to complete a thin film printhead for use in an ink jet printer.


Find Patent Forward Citations

Loading…