The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 28, 1989

Filed:

Oct. 07, 1987
Applicant:
Inventors:

Shiro Nishi, Tokorozawa, JP;

Shigekuni Sasaki, Iruma, JP;

Yoshinori Hasuda, Koganei, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525423 ; 525431 ; 525432 ; 525436 ; 525903 ; 524539 ;
Abstract

A polyetherimide/epoxyimide resin composition prepared by mixing a polyetherimide having a repeating unit represented, for example, by the formula of: ##STR1## with an epoxyimide represented by the following general formula of: ##STR2## wherein R is, for example, selected from the group consisting of diphenyl ether, diphenylmethane, diphenyl sulfone, m-phenylene, p-phenylene and 1,6-hexamehtylene; in a mixing ratio, by weight, of preferably from 6:1 to 1:1. The resin composition is mixed in a solvent to form a solution from which a film may be formed through a flow-coating method. The film made of the polyetherimde/epoxyimide resin composition of the invention, after being removed of the solvent followed by thermal treatment at a temperature of 150.degree. C. to 220.degree. C. for 1 to 3 hours, has improved thermal resistance, adaptability for adhesive, and low moisture permeability.


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