The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1989
Filed:
Apr. 25, 1986
Hideki Kitada, Osaka, JP;
Masami Takahashi, Osaka, JP;
Toshiyuki Yagi, Osaka, JP;
Masaaki Sukeda, Osaka, JP;
Tadashi Nakayama, Osaka, JP;
Takiron Co., Ltd., Osaka, JP;
Abstract
This invention relates to a chlorine-containing resin molding characterized by its stabilization by aminocarboxylic acid and from which molding substantially no metallic ion is detected, and to material for use with the chlorine-containing resin molding consisting of 100 parts by weight of chlorine-containing resin and 0.5-5.0 parts by weight of aminocarbolyxic acid. According to the molding and the material for use therewith, there is no possibility of metallic ion dissolving from the molding in which a metallic stabilizer is conventionally used, with the result that the molding finds wide application in the industrial field related with electric parts including a semiconductor as a main item, medical treatment, chemicals and pharmaceuticals, and food stuffs, all subject to adverse effects by dissolution of metallic ion. Consideration for application of a nonmetallic agent is also given to the use of a coloring agent and a lubricant with respect to the molding and the material for use therewith.