The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 1989

Filed:

Mar. 21, 1988
Applicant:
Inventor:

David T Beegan, Newport Beach, CA (US);

Assignee:

Calcomp Inc., Anaheim, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01D / ;
U.S. Cl.
CPC ...
346155 ; 29854 ;
Abstract

A new design for electrostatic printheads, and the like, which can be formed quickly, easily, inexpensively, and reliably employing wire bonding techniques. The preferred method disclosed is a method for simultaneously making two electrostatic printhead portions each having a row of dot-producing conducting printwire ends at a planar print face. A pair of printed circuit boards containing a plurality of parallel, spaced, flat, conductor strip ends along edges thereof are disposed in a common plane with the conductor strip ends positioned opposite one another in paris. Connecting wires are then wire bonded between the pairs of strip ends. The connecting wires are then embedded in an insulating material which will adhesively bond to the printed circuit boards along the edges thereof and cure into a hard material forming the body of the resultant printhead elements. Finally, the cured insulating material is cut between the edges of the printed circuit boards to form a pair of planar print face surfaces with the ends of the connecting wires exposed, thus producing two printhead portions each attached to a printed circuit board and having a single row of printwires at the print face thereof.


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