The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 1989
Filed:
Nov. 10, 1986
Yoshitugu Eguchi, Ibaraki, JP;
Masaru Miyashita, Tokyo, JP;
Hitoshi Arai, Ibaraki, JP;
Yoshimi Ogushi, Saitama, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
The copper-foiled laminated sheet of the invention is used to prepare a printed circuit sheet having see-throughness after patterning by etching of the copper foil. Different from conventional copper-foiled laminates using an electrolytic copper foil having a surface roughness of 10 or larger, the inventive laminate is prepared using a rolled copper foil having a surface roughness of 1.5 to 5 so that the surface of the adhesive layer, from which the copper foil has been removed by etching, has no undue roughness as a replica of the copper foil surface not to irregularly diffuse the light giving a parallel light-beam transmission of at least 50% and overall light transmission of at least 70% to ensure good see-through visibility.