The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 1989

Filed:

Apr. 09, 1987
Applicant:
Inventors:

Janet E Mebane, San Diego, CA (US);

Lawrence W Chan, San Diego, CA (US);

Duong T La, San Diego, CA (US);

Ruben Nevarez, San Diego, CA (US);

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ; H01R / ;
U.S. Cl.
CPC ...
439 77 ; 29611 ; 29620 ; 29827 ; 174 524 ; 346 75 ; 439 70 ; 439 71 ;
Abstract

Disclosed herein is a method and apparatus for interconnecting a flexible (flex) circuit, printed circuit or the like to an ink jet printhead or other similar electronic device. This approach includes providing a flexible lead frame member between the flex circuit and printhead, with the lead frame member having a plurality of conductive leads or fingers extending at a predetermined angle with respect to the final plane of interconnection. During the interconnection process, these leads or fingers are spring biased through this predetermined angle to provide good compressive electrical contact between the two members interconnected by the lead frame in a single plane of interconnection.


Find Patent Forward Citations

Loading…