The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 1989
Filed:
Mar. 07, 1988
Lewis D Lipschutz, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method of reflowing solder terminals that join an electronic device to a substrate. The method includes the steps of contacting the bottom surface of the substrate with a liquid and then controlling the temperature of the liquid when in contact with the substrate so that the temperature of the liquid in contact with the substrate is varied. The latter step involves rapidly increasing the temperature of the liquid from a temperature below the melting point of the solder to a temperature exceeding the melting point of the solder and then rapidly decreasing the temperature of the liquid to a temperature below the melting point of the solder.