The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 14, 1989

Filed:

Sep. 28, 1987
Applicant:
Inventors:

Yoshihiro Harakawa, Kawasaki, JP;

Koji Izawa, Kawasaki, JP;

Hidemitsu Takeuchi, Kawasaki, JP;

Shinji Nakamura, Kawasaki, JP;

Sadamu Toita, Kawasaki, JP;

Assignee:

Nitsuko Corporation, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G / ; B01J / ;
U.S. Cl.
CPC ...
361525 ; 295701 ;
Abstract

A solid electrolytic capacitor has a capacitor element including a metal plate, such as a plate of aluminum, tantalum, niobium or titanium, capable of having a dielectric oxidation layer formed thereon, a resist layer of a desired shape formed on a predetermined portion of the metal plate, a dielectric oxidation layer formed on a surface of the metal plate at one portion thereof defined by the resist layer, a polymer layer of a heterocyclic compound such as pyrrole, furan or thiophene formed on the dielectric oxidation layer, a conductive layer formed on the polymer layer, a first terminal attached to another portion of the metal plate defined by the resist layer, and a second terminal attached to the conductive layer. In an embodiment, a plurality of the metal plates are stacked to obtain a capacitor element having a multi-layered structure. In another embodiment, the polymer layer and conductive layer are formed successively to obtain an array-type solid electrolytic capacitor element comprising a single metal plate. In a further embodiment, the polymer layer and conductive layer are formed successively to obtain an array-type solid electrolytic capacitor element comprising stacked metal plates.


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