The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 1989
Filed:
Dec. 04, 1981
Hideo Inayoshi, Kokubunji, JP;
Akira Suzuki, Ome, JP;
Kunihiro Tsubosaki, Hino, JP;
Toyoichi Ueda, Katsuta, JP;
Daisuke Makino, Hitachi, JP;
Nobuo Ichimura, Hitachi, JP;
Kazunari Suzuki, Tokyo, JP;
Hitachi, Ltd., Tokyo, JP;
Hitachi Chemical Co., Tokyo, JP;
Hitachi Microcomputer Engineering Ltd., Tokyo, JP;
Abstract
In a resin packaged semiconductor device including a semiconductor element, the back side of which is bonded to a support and the front side of which has electrodes which are electrically connected to electroconductive portions by fine leads, when an adhesive composition comprising an epoxy resin, a novolak type phenolic resin, a solvent for the both resins and a powdery filler, and if necessary, a curing accelerator and a coupling agent, is used for binding the semiconductor and the support, the resulting semiconductor device is excellent in moisture resistance and corrosion resistance.