Modular shielding assembly for electronic devices

Abstract

A modular electronic shielding assembly having a housing in which a ground plane platform is held. The housing is formed from a conductive material which provides for electromagnetic isolation. The ground plane platform also provides for electromagnetic isolation by having disposed on one side thereof a conductive layer. This ground plane platform separates the housing into two electromagnetically isolated compartments. The ground plane platform has electronic circuitry formed upon that surface opposite the conductive layer, which circuitry is isolated from the microwave components by one of two techniques. The first involves mounting the components to the opposite surface of the platform which carries the conductive layer, or by forming the components on one side of a daughterboard with the opposite side bearing a conductive layer. The daughterboard is mounted on that platform surface bearing the circuitry with the daughterboard conductive surface facing the circuitry. The assembly further includes varies electrically conductive framing members which are selectively assembled to construct a desired enclosure about one or more high energy electronic components affixed to one side of the platform. The invention is further directed at particular preconstructed electrically conductive framing members that are selectively positioned together to construct a desired electgromagnetically isolating enclosure about one or more components, particularly a microwave component.