The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 24, 1989

Filed:

Nov. 12, 1987
Applicant:
Inventors:

Horshi Takagi, Kyoto, JP;

Yoshiaki Mori, Kyoto, JP;

Yukio Sakabe, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G / ; H05K / ;
U.S. Cl.
CPC ...
361321 ; 361401 ;
Abstract

A circuit substrate (1) comprises a ceramic laminated structure (10) which has a plurality of ceramic layers (2-7) including ceramic layers (3-6) having cavities (44-49). Chip-like electronic components such as a laminated ceramic capacitor (26, 27) and a resistor (28) are received in the cavities. The chip-like electronic components are formed with external terminal electrodes (29-34) respectively. Conductors (15-20) are formed in through holes (35-43) provided in the ceramic layers and interfaces between adjacent pairs of the ceramic layers, to be connected to the external terminal electrodes. The external terminal electrodes are prepared from metal which is mainly composed of at least one of nickel, copper and palladium, and the conductors are prepared from metal which is mainly composed of copper.


Find Patent Forward Citations

Quick Actions:

Takagi, Horshi. (1989). Circuit substrate having ceramic multilayer structure containing (U.S. Patent No. 4800459). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4800459

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…