The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 1989
Filed:
Sep. 19, 1986
Mitsuru Honda, Chiba, JP;
Atsushi Koike, Chiba, JP;
Kyosuke Ogawa, Miye, JP;
Keiichi Murai, Chiba, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A light receiving member has a support and a light receiving layer. The support has an uneven-shaped surface of a plurality of spherical dimples formed by the impact of a plurality of rigid true spheres on the surface of the support. Each of the dimples has an identical radius of curvature R and an identical width D, wherein the radio D/R of the width D to the radius of curvature R is from 0.03 to 0.07. The light receiving layer is a multi-layered structure having a free surface which formed from an amorphous material containing silicon atoms as the main constituent, at least one of oxygen atoms, carbon atoms and nitrogen atoms, and at least one of hydrogen atoms and halogen atoms. The light receiving layer contains a layer region which functions as a photosensitive layer. The light receiving member, when used with a coherent laser beam as an optical source, acts to prevent the occurrence of an interference fringe pattern during image formation. Further, the light receiving member has a high photosensitivity in the entire visible light region; is photosensitive to longer wavelengths; exhibits a rapid optical response; shows better electrical, optical and electroconductive properties; resists electrical voltage breakdown and is resistant to the effects of harsh environments.