The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 17, 1989
Filed:
Mar. 21, 1988
Gerard H Michaud, Furlong, PA (US);
James H Graham, Pottstown, PA (US);
Roger P Stout, Chandler, AZ (US);
Kulicke & Soffa Industries, Inc., Willow Grove, PA (US);
Abstract
Apparatus for and methods of bonding electrical components or semiconductor chips to a substrate or lead frame is disclosed. According to the present invention, a sawn semiconductor wafer is held upside down in a first substantially horizontal plane and the substrate or lead frame to which it is to be bound is held in a second plane which is below and substantially parallel to the first plane. A die eject head located above the sawn wafer cooperates with a die bond head located between the wafer and the substrate to remove an individual die from the sawn wafer. The die bond head then rotates about an axis which is parallel to both planes and places the die on the lead frame. Also included is a transducer means which is responsive to electrical stimulus for actuating the die eject head and the die bond head such that the interactive force between the heads and the component may be precisely controlled. A die locating system which is located at least in part between the first and second planes, is also provided for producing an image of the candidate die to be transferred. The configuration of the die bond head in combination with the mode of operation of the die bonding apparatus allows efficient operation of the die locating system.