The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 1989
Filed:
Apr. 09, 1987
Applicant:
Inventor:
David J Brownell, Maple Grove, MN (US);
Assignee:
Honeywell Inc., Minneapolis, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437187 ; 437189 ; 437195 ;
Abstract
Disclosed is a method of fabricating a semiconductor device comprising the step of defining metal interconnect features in a metal layer so that a metal feature having a size substantially larger than a predetermined feature size comprises an array of metal features. Each of the metal features in the array has a size not substantially larger than the predetermined feature size.
Brownell, David. (1989). Fabrication of metal interconnect for semiconductor device (U.S. Patent No. 4797375). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4797375
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile