The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 1989

Filed:

Feb. 17, 1987
Applicant:
Inventors:

Wolfgang Boehm, Alzenau-Albstadt, DE;

Juergen Hausselt, Langenselbold, DE;

Wolfgang Weise, Frankfurt am Main, DE;

Willi Malikowsik, Aschaffenburg, DE;

Assignee:

Degussa Aktiengesellschaft, Frankfurt am Main, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; C22C / ; C22C / ;
U.S. Cl.
CPC ...
428621 ; 228121 ; 228122 ; 22826312 ; 420557 ; 420563 ; 420566 ; 428457 ; 428645 ; 428646 ;
Abstract

Soft-solder alloys for connecting ceramic parts without permetallization comprising 86 to 99% lead or tin, 0 to 13% silver and/or copper, 0 to 10% indium and 1 to 10% titanium and/or zirconium.


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