The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 10, 1989

Filed:

Dec. 18, 1985
Applicant:
Inventor:

Hisashi Kojima, Tokyo, JP;

Assignee:

Technoplas, Inc., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
264 401 ; 264 405 ; 26432813 ; 26432816 ; 264102 ; 264571 ; 425546 ;
Abstract

A method for injection molding a material involving bringing the interior of a tightly sealed injection mold under a high vacuum, then injecting the material into the interior of the injection mold at an ultrahigh speed in the vicinity of a speed at which adiabatic change is exerted on the material in accordance with a predetermined pattern of internal pressure so as to fill the interior of the injection mold with the material, and molding the material under low pressure. An injection molding apparatus used for carrying out the aforementioned method is capable of bringing the interior of the injection mold to a high vacuum.


Find Patent Forward Citations

Kojima, Hisashi. (1989). Ultrahigh speed injection molding method (U.S. Patent No. 4797236). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4797236

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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