The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 1989
Filed:
Apr. 13, 1987
Tsuyoshi Hayakawa, Tokyo, JP;
Satoru Yamauchi, Tokyo, JP;
Isato Watanabe, Tokyo, JP;
Isao Kondo, Tokyo, JP;
Seikosha Co., Ltd., Tokyo, JP;
Abstract
A circuit unit including a plurality of lead frames which are made of a metal sheet and one of which is used for die-bonding an integrated circuit. The die-bonding lead member is formed to have at least a generally H-shaped portion constructed of a pair of parallel side portions and a connecting portion for connecting the two side portions for die-bonding the integrated circuit thereto. The remaining lead members are separated from said die-bonding one and have individual end portions positioned in the vicinity of the integrated circuit and connected electrically therewith by means of bonding wires. The die-bonding lead member and the remaining lead members are integrated either with a potting resin for protection the integrated circuit or with the potting resin and/or an insulating plate backing the potting resin. The aforementioned two side portions are fixed on a holding member. Also disclosed is a process for fabricating the aforementioned circuit unit.