The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 03, 1989
Filed:
Aug. 20, 1987
Toshiyuki Saito, Kawasaki, JP;
Naofumi Okubo, Kawasaki, JP;
Yoshiaki Kaneko, Yokohama, JP;
Yasuyuki Tokumitsu, Isehara, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A liquid cooling type high frequency solid state device comprising: a solid state chip; at least one matching circuit connected to the solid state chip; a carrier for mounting the solid state chip and the matching circuit, constituting a solid state circuit to be cooled; a coolant vessel for containing a liquid coolant, with a space for coolant vapor at the top thereof; and an element for condensing the coolant vapor contained in the top space of the vessel. At least a part of the solid state circuit contacts the liquid coolant for boiling and evaporating the coolant. Amplitude modulation of the solid state circuit due to the boiling of the coolant is prevented.