The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 1988

Filed:

Oct. 28, 1987
Applicant:
Inventor:

Hideyasu Nikaido, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
428620 ; 148D / ; 437192 ; 437194 ; 437220 ;
Abstract

In a lead frame for an IC which is provided on a wire bonding part of the inner lead unit thereof with an aluminum coating, possible detrimental diffusion of the component elements of the lead frame into the aluminum coating can be effectively precluded by having a layer of a high melting point metal interposed between the lead substrate and the aluminum coating in the wire bonding part without appreciably increasing the cost of production.


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