The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 06, 1988
Filed:
May. 04, 1987
Gerald R Dunn, Carlsbad, CA (US);
Kenneth W Economy, San Marcos, CA (US);
Thomas A Snodgrass, Carlsbad, CA (US);
Unisys Corporation, Detroit, MI (US);
Abstract
A method of soldering component leads to I/O pads on a printed circuit board, without desoldering any other circuit components which were previously soldered to the board near the pads, includes the steps of: forming a mechanical assembly in which respective joints of the pads and the leads and respective solder mounds are mechanically held together; moving the assembly at a predetermined speed on a conveyor such that the joints, but not the previously soldered components, sequentially pass through a target area which is small relative to the total number of joints; and melting and then hardening the solder mounds, without desoldering the previously soldered components, by directing a focused stream of hot gas at the target area as the joints move therethrough on the conveyor.