The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 1988

Filed:

Sep. 03, 1987
Applicant:
Inventors:

Nobuo Fukushima, Otsu, JP;

Shuji Kitamura, Nagaokakyo, JP;

Kiyohiko Nakae, Nishinomiya, JP;

Yoshiaki Togawa, Kyoto, JP;

Kozo Kotani, Toyonaka, JP;

Toshitsugu Kikuchi, Ibaraki, JP;

Seiichi Shibata, Takatsuki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428215 ; 428212 ; 428332 ; 428461 ; 428463 ; 428495 ; 428517 ; 428518 ; 428519 ;
Abstract

A vibration-damping material with excellent workability consisting of two metal plates and a vibration-damping layer of a thermoplastic resin interposed between the two metal plates, in which the vibration-damping layer of a thermoplastic resin consists of a film as a middle layer and a polyolefin type resin (B) provided on both sides of the film as an upper and lower layer, the film as the middle layer being composed of (1) at least one resin (A) selected from the group consisting of polyolefin type resins and ionomer resins each having a modulus of elasticity in shear at 20.degree. C. of 3.times.10.sup.9 to 1.times.10.sup.7 dyne/cm.sup.2, a percentage of elongation at 20.degree. C. of 50% or above and a peak temperature of dissipation factor (tan .delta.) of -120.degree. C. to 80.degree. C. or (2) a resin mixture of the resin (A) and a synthetic rubber having a percentage of elongation at 20.degree. C. of 100% or above and a peak temperature of dissipation factor (tan .delta.) of -120.degree. to 50.degree. C., and the polyolefin type resin (B) having a modulus of elasticity in shear at 20.degree. C. larger than that of the resin (A), a percentage of elongation at 20.degree. C. of 10% or above, a peak temperature of dissipation factor (tan .delta.) of -40.degree. to 180.degree. C. and a bonding strength toward the metal plates at 20.degree. C. and 180.degree. -peeling of 3 kg/cm or above.


Find Patent Forward Citations

Loading…