The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 29, 1988
Filed:
Jun. 24, 1987
Applicant:
Inventor:
Tadahiro Okamoto, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kanagawa, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156285 ; 100210 ; 156299 ; 156312 ; 156382 ; 156481 ; 156555 ; 156582 ;
Abstract
A method and apparatus for adhering an adhesive-backed tape or sheet to a surface of a semiconductor wafer. The apparatus comprises a housing forming a vacuum working chamber containing a supporting table for the semiconductor wafer and a plurality of rollers for exerting pressure on an adhesive-backed tape or sheet and pressing it against the wafer surface. The rollers comprise rubber rollers having different axial lengths so that, even if the wafer is warped, the tape or sheet can be uniformly adhered to the whole surface of the wafer.