High-speed electrical component lead forming apparatus and method

Abstract

In apparatus for disposing DIP leads in a predetermined and preselected condition of straightness and orientation, a trackway for operatively supporting and moving DIPs therealong from a loading station to a discharge station, a forming station positioned along the trackway subsequent to said entrance station. The forming station includes laterally spaced rotatable forming rollers on opposite sides of the trackway, anvils confronting the inner faces of the leads between the forming rollers and anvils. The rollers and anvil having cooperating confronting surfaces adapted to engage the DIP leads adjacent the shoulder to the outer terminal ends, the forming rollers cooperatively associated with the anvils and spaced therefrom to define a nip gap. DIPs are moved through the nip gap whereby DIP leads are contacted to align them in predetermined orientation and at a predetermined angle relative to the body portion. The anvils are spring biased so that leads passing between the confronting surfaces the forming rollers and anvil creates a predetermined adjustable gap at the pointy of tangency of the forming rollers circumference and a DIP lead. This ensures the proper angle of divergence of each lead, removal of any adherent compound bending of a lead and ensures that each of the leads following preceding ones will fall within a common plane.