The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 1988
Filed:
Jun. 06, 1986
Applicant:
Inventor:
Tim R Koch, Corvallis, OR (US);
Assignee:
Hewlett-Packard Company, Palo Alto, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H / ;
U.S. Cl.
CPC ...
357 71 ; 357 65 ; 357 67 ; 437 51 ; 437 56 ;
Abstract
The specification describes a multilevel metal CMOS integrated circuit wherein a first or lower level of metallization comprises strips of tungsten over aluminum. These strips are connected through vias in an inter-metal dielectric layer to an upper or second level of metallization which is photodefined in a desired pattern. The tungsten suppresses hillocks in the underlying aluminum during high temperature processing and also advantageously serves as an etch stop material during integrated circuit fabrication.