The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 1988
Filed:
Jul. 20, 1987
Applicant:
Inventors:
Chi-Long Lee, Midland, MI (US);
Robin L Willis, Jr, Midland, MI (US);
Assignee:
Dow Corning Corporation, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; B01J / ;
U.S. Cl.
CPC ...
42721334 ; 264-47 ; 42721336 ; 42840221 ; 42840222 ; 528 15 ; 528491 ; 528901 ;
Abstract
Compounds of metals from the platinum group of the periodic table compounds are encapsulated within a thermoplastic organic polymer using known prior art techniques. The presence of trace amounts of the encapsulated compound on the surface of the microcapsules is avoided by preparing the microcapsules by in-situ polymerization or precipitation of the encapsulant, followed by washing of the microcapsules with a solvent for the encapsulated compound that will not dissolve or swell the encapsulating polymer.