The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 1988
Filed:
Jul. 03, 1986
Hermann Diethelm, Giffers, CH;
Wolfgang Dresen, Rufenacht, CH;
Ciba-Geigy Corporation, Ardsley, NY (US);
Abstract
Molded bodies of thermoset material are produced from monomers, oligomers or higher pre-polymers of reactive resins by pressure reaction injection molding. The molded bodies may contain filler and/or reinforcing material. The process is carried out in a mold consisting of a first, preferably upper half mold and a second, preferably lower half mold, and an inlet socket opening downwardly into the first half mold. The mold is equipped with heating coils adapted for applying separately a lower temperature to the first half mold and a higher temperature to the second one. During the introduction and hardening phase of the reactive mixture, the first half mold is maintained at a lower temperature than the second half mold, the temperature difference amounts to about 40 to 180, and preferably 60 to 120 centigrades.