The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 1988

Filed:

Jan. 30, 1986
Applicant:
Inventors:

Minoru Ohta, Okazaki, JP;

Kazuhiko Miura, Aichi, JP;

Michitoshi Onoda, Toyohashi, JP;

Yukio Iwasaki, Gifu, JP;

Tadashi Hattori, Okazaki, JP;

Assignee:

Nippon Soken, Inc., Nishio, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F / ;
U.S. Cl.
CPC ...
7320417 ; 7320421 ; 7320426 ;
Abstract

A direct-heated flow measuring apparatus including a substrate, a film resistor for generating heat and sensing its temperature, and a feedback control circuit for controlling the heat generated by the film resistor so that the temperature of the film resistor is a predetermined value. Also, provided in the substrate is an aperture or the like for throttling the heat transfer of the film resistor. Further, a reinforced structure is formed on the part of substrate where the aperture or the like is formed.


Find Patent Forward Citations

Ohta, Minoru. (1988). Direct-heated flow measuring apparatus (U.S. Patent No. 4783996). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4783996

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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