Process of connecting lead frame to a semi-conductor device and a device

Abstract

A lead frame having opposite rows of leads to be connected to the edges of a semi-conductor device and heads on one end of the leads provided with similar angularly related legs between which the edges of the device are received for ultimate soldered connection thereto, the leads and corresponding heads respectively extending from opposite sides of an elongated supporting strip connected at the ends thereof to the lead frame adjacent recesses in the frame to permit bending of the rows of leads substantially along the axis of the supporting strip and thereby extend the heads of the leads upwardly to cause the uppermost legs of the heads of opposite rows thereof to be spaced apart a distance greater than the width of the device to be connected thereto while the ends of the rows of lowermost legs of the heads are spaced a distance less than the width of the device to be supported thereon prior to the rows of leads being reversely bent to restore the bent leads and heads thereon to the plane of the frame and thereby cause the opposite rows of uppermost legs to be extended toward each other adequately to overlie the edges of the device and in conjunction with the lowermost legs of the heads secure the device between the rows of heads. The invention also includes a process for accomplishing the foregoing results and a forming device to achieve the same.