The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 1988
Filed:
Mar. 02, 1988
George C Wolf, Kokomo, IN (US);
Delco Electronics Corporation, Kokomo, IN (US);
Abstract
This invention comprehends an improved method for uniformly loosening and removing the thin layer of mold flash which deposits on the surface of the metal lead frames during encapsulation of the silicon integrated circuit chips bonded to that metal lead frame surface. The disclosed method does not adversely effect the underlying metal material or the encapsulating plastic material enveloping the silicon integrated circuit chip. The disclosed method is electrolytic and employs (1) the chemical dissolving action of the stripping solution and (2) the percolating effect of the hydrogen gas generated during electrolysis of the water, to loosen the unwanted organic mold flash from the metal lead frame surface. The disclosed electrolytic method for removal of mold flash employs an aqueous based stripping solution preferably comprising;