The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 01, 1988
Filed:
May. 29, 1987
Shoji Shiga, Utsunomiya, JP;
Shinichi Konishi, Hiratsuka, JP;
Hideo Suda, Imaichi, JP;
Yoshiaki Ogiwara, Nikko, JP;
Furukawa Denki Kogyo Kabushiki Kaisha, Tokyo, JP;
Abstract
A rigid-type multilayer printed wiring board is produced by bonding a multilayer printed wiring sheet substantially comprising a thin insulating resin layer (1), at least one metal foil printed wiring layer (8, 11) and a plurality of conductive holes (7) formed through the two layers onto a metal board (10) through an insulation laminate (9). In according this method, a multilayer printed wiring interlayer sheet consisting of the multilayer printed wiring sheet retaining a printed wiring pattern unprocessed metal foil (2b) on one surface thereof is prepared first. In this case, a given printed wiring has already been processed on the other surface and sometimes in the inner portion of the interlayer sheet. Then, the other surface of the interlayer sheet is bonded to the surface of the metal board through the insulation laminate. Thereafter, a desired printed wiring pattern is formed on the printed wiring pattern unprocessed metal foil (2b) on the one surface of the interlayer sheet.