The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 18, 1988

Filed:

Feb. 16, 1988
Applicant:
Inventors:

Shinichiro Hirota, Tokyo, JP;

Kishio Sugawara, Tokyo, JP;

Tetsuro Izumitani, Tokyo, JP;

Assignee:

Hoya Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B / ;
U.S. Cl.
CPC ...
65102 ; 65 64 ; 65 77 ; 65104 ; 65268 ; 65275 ; 65286 ; 65321 ;
Abstract

According to a method of molding a glass body, a glass preform is placed between upper and lower molds of a mold assembly. The mold assembly is then heated to a predetermined heating temperature falling within a heating temperature range corresponding to a glass viscosity range of the glass preform of 10.sup.8 to 10.sup.10.5 poise. A pressure high enough to mold the glass preform is applied between the upper and lower molds when the glass preform is at the predetermined heating temperature, so that an unfinished glass molded body is formed. The pressure is released, and the unfinished glass molded body and the mold assembly are gradually cooled to a temperature within a glass viscosity range of 10.sup.11.5 to 10.sup.14 poise while the unfinished glass molded body is held in the mold assembly. A glass molded body is then released from the mold assembly.


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