The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 18, 1988
Filed:
Dec. 07, 1987
David R Dines, Oklahoma City, OK (US);
American Telephone and Telegraph Company, AT&T Technologies, Inc., Berkeley Heights, NJ (US);
Abstract
The present invention is directed to a method for soldering each of a plurality of members (40), arranged in one or more parallel rows, to a separate one of a plurality of metallized pads (42) on a substrate (10), each pad being contiguous with a corresponding member. The method is initiated by tilting the substrate so that one end of each row of members and the metallized pads contiguous therewith are at a higher elevation than the other end. A stream (80) of molten solder and a dripping stream (88) of flux droplets are directed onto the substrate into the regions where the members are contiguous with the metallized pads. Simultaneously, the substrate is displaced relative to the streams along a path (96) inclined with respect to the horizontal and parallel to the rows of members so that the members and the metallized pads are successively coated with solder and then flux. The inclination of the substrate is such that the solder and flux flow downwardly, under gravity, past a successive one of the members and metallized pads. The force of gravity on the solder, together with the presence of the flux, is sufficient to break the surface tension of the solder between adjacent members to prevent a solder bridge therebetween.