The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1988
Filed:
Nov. 25, 1986
Hideki Kuwabara, Hadano, JP;
Masato Kanbe, Hiratsuka, JP;
Japan Styrene Paper Corporation, Tokyo, JP;
Abstract
An expansion-molded article of a polypropylene resin is produced by filling pre-foamed particles of the polypropylene resin, which have a crystalline structure featuring an inherent peak inherent to the polypropylene resin and a high-temperature peak on the temperature side higher than the temperature corresponding to the inherent peak on a DSC curve obtained by differential scanning calorimetry of the pre-foamed particles and a bulk density of 0.04 g/cm.sup.3 or higher and require melting energy of 8-12 J/g at the high-temperature peak, in a mold without applying any pretreatment to the pre-foamed particles to build up an internal pressure therein, and then heating the pre-foamed particles, whereby the pre-foamed particles are caused to expand into the expansion-molded article conforming with the mold. The pre-foamed particles may alternatively have a bulk density lower than 0.04 g/cm.sup.3 and require melting energy of at least 8 J/g.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile