The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 11, 1988
Filed:
Feb. 05, 1987
Larry K Johnson, North Attleboro, MA (US);
Austin S O'Malley, Rehoboth, MA (US);
Robert M Fife, Attleboro, MA (US);
Walter L Walas, Rehoboth, MA (US);
Robert K Peterson, Garland, TX (US);
Larry J Mowatt, Allen, TX (US);
Maurice M Guy, Garland,, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A circuit board system resiliently mounts a plurality of daughter boards with high circuit interconnection density on a mother board using pairs of mating connectors having welded contact members accommodated in novel arrangements in the respective connectors to permit high density of electrical interconnection with convenience and reliability. Contact parts of substantial size are welded into contacts in one connector to detachably interconnect with contact parts of similar size in mating connector to improve interconnection releability. Novel contact arrangements permit accommodation of those parts of substantial size in the mating connectors. Sheet metal spring or post parts welded into the contacts in both connectors permit the contacts to be conveniently loaded into connector bodies and permit large numbers of contact springs or posts to be soldered to terminal pads or circuit paths on mother or daughter boards with high density. Temporary fixtures mount on connectors to facilitate precise soldering of leaf springs to very closely spaced terminal pads on daughter boards; resilient mounting of the mother board facilitate daughter board engagement with heat sinks; and organizer plates fit on extending ends of connector contact posts to facilitate their insertion into mother board mounting holes with high interconnection density.