The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 1988
Filed:
Apr. 10, 1986
James M Beggs, Washington, DC (US);
John A Mikroyannidis, Patras, GB;
Demetrius A Kourtides, Gilroy, CA (US);
Abstract
The subject invention pertains to a novel class of fire- and heat-resistant bisimide resins prepared by thermal polymerization of maleimido or citraconimido substituded 1-[(dialkoxyphosphonyl)-methyl]-2-4 and -2,6-diaminobenzenes. Typical polymer presursors have the chemical structure: ##STR1## wherein R is alkyl, substituted alkyl or aryl, and R.sup.1 is hydrogen or lower alkyl. The polymer precursors are prepared by reacting 1-[(diorganooxyphosphonyl)methyl]-2-4 and -2,6-diaminobenzenes with maleic anhydride or citraconic anhydride in a mole ratio 1:2. Chains extension of the monomers is achieved by reacting the mono-N-maleimido derivatives of 1-[(diorganooxyphosphonyl)methyl]-2,4 and -2,6-diaminobenzenes with aryl tetracarboxylic dianhydrides, such as benzophenone tetracarboxylic diandydride, or aryl diisocyanates, such as methylenebis(4-phenylisocyanate), in a mole ratio 2:1. The polymerization of the monomers is studied by differential scanning calorimetry (DSC) and the thermal stability of the polymers is ascertained by thermogravimetric analysis (TGA).