The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 20, 1988
Filed:
Jan. 12, 1987
Applicant:
Inventor:
Tadashi Hirao, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437 33 ; 437 31 ; 437 41 ; 437 59 ; 357 43 ;
Abstract
A method of producing a semiconductor integrated circuit device in which a bipolar element and a MOS element are produced on a same chip, which includes forming an oxide film on the epitaxial regions of the device; depositing a silicon film on the device over epitaxial regions and forming a base electrode leading region using said silicon; and forming a base leading layer by diffusion from said base electrode leading region to reduce the distance between a collector leading region and the base electrode leading region, thereby enhancing the characteristics of the bipolar element.