The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 13, 1988

Filed:

Jun. 09, 1986
Applicant:
Inventors:

Takahiro Daikoku, Ibaraki, JP;

Tadakatsu Nakajima, Ibaraki, JP;

Noriyuki Ashiwake, Ibaraki, JP;

Keizo Kawamura, Ibaraki, JP;

Motohiro Sato, Ibaraki, JP;

Fumiyuki Kobayashi, Sagamihara, JP;

Wataru Nakayama, Kashiwa, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F / ;
U.S. Cl.
CPC ...
165185 ; 361383 ; 361386 ; 357 81 ;
Abstract

A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.


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