The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1988
Filed:
Apr. 24, 1986
Applicant:
Inventors:
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 67 ; 357 74 ; 174 / ;
Abstract
The metal powder composition for the metallizing paste is composed of not less than 90 wt % gold, 0.03-3.0 wt % cadmium, 0.1-2.0 wt % bismuth, 0.01-1.0 wt % copper, 0.01-2.0 wt % germanium and 0.01-1.0 wt % silicon. The metallized paste bonds both the silicon carbide sintered substrate and the silicon semiconductor element with a high bonding strength.
Suzuki, Hideo. (1988). Metallizing paste for silicon carbide sintered body and a semiconductor (U.S. Patent No. 4769690). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4769690
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile