The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 1988
Filed:
Feb. 17, 1987
Yasushi Takizawa, Komoro, JP;
Atsushi Sasayama, Komoro, JP;
Yoshihiko Kobayashi, Tateshina, JP;
Yukio Takahashi, Komoro, JP;
Yuuji Kakegawa, Komoro, JP;
Hitachi, Ltd, Tokyo, JP;
Hitachi Tobu Semiconductor, Ltd., Saitama, JP;
Abstract
An optoelectronics device wherein a light-receiving element which defines a monitor light receiver and a semiconductor laser which generates a laser beam are hermetically sealed in the same package, and wherein the light-receiving surface of the element for measuring the output power of the beam of light emitted from the semiconductor laser is disposed so as to be inclined with respect to the light-emitting surface of the semiconductor laser. The wire bonding surface of the light-receiving element pellet-bonded to a stem and the wire bonding surface of the lead electrically connected to the light-receiving element through a wire are arranged so as to be parallel with each other. Thus, it is possible to support both the bonding surfaces horizontally at the same time. As a result, a bonding tool can be brought into perpendicular contact with each of the bonding surfaces, and this enables appropriate wire bonding to be effected.