The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 1988
Filed:
Oct. 29, 1987
John R Hale, East Hempfield Township, Lancaster County, PA (US);
RCA Licensing Corporation, Princeton, NJ (US);
Abstract
A stem mold includes an improved first (upper) mold assembly and a conventional second (lower) mold assembly. The first mold assembly includes a conventional mold head and a plurality of lead-weights which are attached to one end of the mold head. The first mold assembly is improved by the inclusion of a novel first mold block which has a plurality of fillet recesses therein which communicate through guide openings with a plurality of buffer-pin-wells extending into a cavity in a second surface of the mold block. A novel lead-weight translator is disposed within the cavity in the mold block. The translator has a translator recess formed in one surface and a plurality of lead-weight apertures extending from the recess through the other surface of the translator. A pin holder is disposed within the translator recess. A plurality of pin apertures are formed through the pin holder and aligned with the buffer-pin-wells in the mold block and also with the lead-weight apertures in the translator. A plurality of buffer pins are disposed in the pin apertures and extend into the pin wells. The buffer pins are configured to extend between the lead-weights and the internal portions of the lead-in conductors to retain the external portion of the lead-in conductors within the second mold assembly during the stem manufacturing operation. The buffer pins accommodate lead-in conductors of various internal lengths.