The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 30, 1988

Filed:

Sep. 25, 1987
Applicant:
Inventors:

Hiroyuki Okamoto, Shizuoka, JP;

Takao Sagawa, Shizuoka, JP;

Yukio Shibata, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425190 ; 264 405 ; 2642972 ; 2643284 ; 2643287 ; 425398 ; 425419 ; 425556 ; 425574 ; 425588 ;
Abstract

In a conventional multiplunger transfer molding die apparatus having plungers for pressurizing molding material put in plural material supply pots formed in each mated surface of upper and lower chase blocks, when the pitch of the material supply pots is required to change, the whole die apparatus has been exchanged, thus a complicated adjustment work of the plunger pitch, a broad die storage space, an uneconomical die apparatus preparation being required. To overcome these problems, only the upper and lower chase blocks are exchanged and the pitch of plungers is adjusted according to the replaced chase blocks by means of locating means.


Find Patent Forward Citations

Okamoto, Hiroyuki. (1988). Exchangeable multiplunger transfer molding die apparatus (U.S. Patent No. 4767302). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4767302

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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