The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 1988

Filed:

Jul. 14, 1986
Applicant:
Inventors:

Isao Yoshimura, Fujisawa, JP;

Takashi Nakao, Kawasaki, JP;

Mitsuo Kohno, Yokohama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B41C / ; B41N / ;
U.S. Cl.
CPC ...
428332 ; 428340 ; 428481 ; 4284796 ; 428227 ; 428229 ; 428364 ; 428442 ; 428518 ; 428910 ; 428516 ; 4284761 ; 427143 ; 2641761 ;
Abstract

The present invention relates to a highly sensitive heat-sensitive film for stencil. This invention provides a highly heat-sensitive film for stencil, comprising a thermoplastic resin having a coefficient of temperature and melt viscosity (.DELTA.T/.DELTA. log VI) of not more than 100 and a thermal shrinkage (X%) at 100.degree. C. and a thermal shrinkage stress (Y g/mm.sup.2) at 100.degree. C. falling respectively in the ranges of the formulas; 15.ltoreq.X.ltoreq.80 and 75.ltoreq.Y.ltoreq.500; and both falling in the range of the formula; -8X+400.ltoreq.Y.ltoreq.-10X+1000; having a thickness in the range of 0.5 to 15 .mu.m, and excelling in low-energy perforation property. The film of this invention is superior in a low temperature perforation property, capable of being perforated with a low energy thermal head or with a low energy flash irradiation for making a plate; expansion of perforations is small when the film is perforated; and its change with time (dimensional change) is small and its sizes are stable.


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