The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 1988
Filed:
Jan. 20, 1987
Haruo Komoto, Hyogo, JP;
Shigeharu Hamada, Hyogo, JP;
Yasuo Shiinoki, Hyogo, JP;
Katsumi Nagano, Fukuoka, JP;
Michio Sato, Aichi, JP;
Hiroo Goshi, Aichi, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Abstract
An apparatus for automatically maintaining plating current density within a predetermined range while controlling plating current to produce a desired plating thickness includes means for energizing only the number of plating cells required to maintain plating current density within the predetermined range. The total plating current required to produce the desired plating thickness is distributed among the energized plating cells. Decreases in the number of energized plating cells is made at speed values which are less by a hysteresis value than speeds at which the number of energized plating cells is increased to avoid instability due to normal speed reading variations.