The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 1988
Filed:
Jan. 16, 1987
Masayuki Ishihara, Neyagawa, JP;
Keizo Makio, Shijonawate, JP;
Matsushita Electric Works, Ltd., Osaka, JP;
Abstract
A sintered glass-powder product of a glass ceramic body, consisting essentially of: SiO.sub.2, Al.sub.2 O.sub.3, MgO, and B.sub.2 O.sub.3, and sintered at a temperature below 900.degree. C. The product includes a microstructure of alpha-cordierite and magnesium aluminum silicate (MgO.Al.sub.2 O.sub.3.4SiO.sub.2) homogeneously dispersed in the glass ceramic body. When the sintered glass-powder product is used in the form of a green sheet for fabricating, in particular, a multilayer wiring substrate or the like, the required sintering temperature for fabricating the substrate can be remarkably reduced so as to be well-matched in thermal characteristics with such wiring conductors as gold, silver, copper, or the like, and even with a relatively large semiconductor chip because the thermal expansion coefficient of the sintered product is close to that of silicon semiconductor.