The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 1988

Filed:

Jan. 05, 1987
Applicant:
Inventors:

James A Loughran, Scotia, NY (US);

James G McMullen, Pattersonville, NY (US);

Alexander J Yerman, Scotia, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23F / ; B44C / ;
U.S. Cl.
CPC ...
437225 ; 156643 ; 156655 ; 156656 ; 1566591 ; 148D / ; 148D / ; 148D / ; 148D / ; 148D / ; 21912165 ; 21912168 ; 21912167 ; 430317 ; 437173 ; 437928 ; 437935 ; 437203 ;
Abstract

A method for producing a hole in a polymer film includes the steps of depositing a conductive layer onto the polymer film and irradiating a spot on the layer with a burst of focused laser energy at a level sufficient to form an opening in the film and, subsequently, plasma etching the film so as to form a hole of desired depth in the polymer film underlying the opening in the conductive layer. This method is particularly applicable to the formation of multichip intergrated circuit packages in which a plurality of chips formed in a semiconductor wafer are coated with a polymer film covering the chips and the substrates. The holes are provided for the purpose of interconnecting selected chip contact pads via a deposited conductive layer which overlies the film and fills the holes.


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