The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 1988
Filed:
May. 23, 1986
Erno Gyarmati, Julich, DE;
Aristides Naoumidis, Julich, DE;
Kernforschungsanlage Julich GmbH, Julich, DE;
Abstract
Silicon carbon molded parts, whether made of silicon carbide sintered together in the absence of pressure or hot pressed silicon carbide are bonded together at close fitting surfaces by applying a layer not thicker than 1 .mu.m on polished surfaces to be joined, containing at least one carbide and/or silicide forming element from the group Ag, Al, Au, B, Be, Co, Cr, Cu, Fe, Mg, Mn, Mo, Nb, Ni, Pd, Pt, Ta, Ti, V, W and Zr. The surfaces to be joined are than fitted together and heated in an inert or reducing atomosphere at a pressure between 10.sup.-1 and 10.sup.-5 Pa at temperatures in the range 800.degree. to 2200.degree. C. while under a pressure applied which is between 1 and 100 MPa. In particular, the heat treatment range from 1550.degree. C. to 1750.degree. C. under a pressure of 15 to 45 MPa applied pressure in argon at a pressure of from 10.sup.3 to 10.sup.5 Pa argon, for 30 to 60 minutes. Preferably a thin layer is vapor-deposited or sputtered. Cr, Cu, Ni, Pt and/or Pd, and especially Cu and its alloys, have been found particularly effective.